Low Power DDR4/4X SDRAM

Low Power DDR4/4X SDRAMs (Low Power Double Data Rate SDRAMs 4th generation) are memories with 1.8/1.1/1.1 V (DDR4) or 1.8/1.1/0.6 V (DDR4X) power supply, designed with specific features to reduce power consumption.
All ICs are RoHS compliant.

* Status: P - mass production, S - samples, UD - under development, N - not recommended for new design.

Chip Description Density
(organization) 		Clock
  frequency   		Supply
  voltage  
[V] 		Operating
temperature
[°C] 		   Package    Status *
Automotive Commercial
& Industrial
W66AP6NBU
  • Single-Die-Package (SDP), single channel memory
  • synchronous burst mode interface
  • burst length: 16/32 bytes
  • 8 banks
  • differential clock inputs
  • refresh modes: Auto Refresh (per bank), partial array Self Refresh
  • Power-down mode
  • operating temperature range: industrial plus (J)
 1 Gbit
(64Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 1.1 -40 – +105 (J) WFBGA-200 - P
W66AQ6NBU 1 Gbit
(64Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 0.6 -40 – +105 (J) WFBGA-200 - P
W66AP6NBH
  • Single-Die-Package (SDP), single channel memory
  • synchronous burst mode interface
  • burst length: 16/32 bytes
  • 8 banks
  • differential clock inputs
  • refresh modes: Auto Refresh (per bank), partial array Self Refresh
  • Power-down mode
  • operating temperature range: industrial plus (J)
 1 Gbit
(64Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 1.1 -40 – +105 (J) VFBGA-100 - P
W66AQ6NBH 1 Gbit
(64Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 0.6 -40 – +105 (J) VFBGA-100 - P
W66AP6NBQ
  • Single-Die-Package (SDP), single channel memory
  • synchronous burst mode interface
  • burst length: 16/32 bytes
  • 8 banks
  • differential clock inputs
  • refresh modes: Auto Refresh (per bank), partial array Self Refresh
  • Power-down mode
  • operating temperature range: industrial plus (J)
 1 Gbit
(64Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 1.1 -40 – +105 (J) TFBGA-200 - P
W66AQ6NBQ 1 Gbit
(64Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 0.6 -40 – +105 (J) TFBGA-200 - P
W66BP6NBU
  • Single-Die-Package (SDP), single channel memory
  • synchronous burst mode interface
  • burst length: 16/32 bytes
  • 8 banks
  • differential clock inputs
  • refresh modes: Auto Refresh (per bank), partial array Self Refresh
  • Power-down mode
  • operating temperature range: industrial plus (J), automotive
 2 Gbit
(128Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 1.1 -40 – +105 (I)

Automotive		 WFBGA-200 P P
W66BQ6NBU 2 Gbit
(128Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 0.6 -40 – +105 (I)

Automotive		 WFBGA-200 P P
W66BP6NBH
  • Single-Die-Package (SDP), single channel memory
  • synchronous burst mode interface
  • burst length: 16/32 bytes
  • 8 banks
  • differential clock inputs
  • refresh modes: Auto Refresh (per bank), partial array Self Refresh
  • Power-down mode
  • operating temperature range: industrial plus (J)
 2 Gbit
(128Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 1.1 -40 – +105 (I) VFBGA-100 - P
W66BQ6NBH 2 Gbit
(128Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 0.6 -40 – +105 (I) VFBGA-100 - P
W66BP6NBQ
  • Single-Die-Package (SDP), single channel memory
  • synchronous burst mode interface
  • burst length: 16/32 bytes
  • 8 banks
  • differential clock inputs
  • refresh modes: Auto Refresh (per bank), partial array Self Refresh
  • Power-down mode
  • operating temperature range: industrial plus (J)
 2 Gbit
(128Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 1.1 -40 – +105 (I) TFBGA-200 - P
W66BQ6NBQ 2 Gbit
(128Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 0.6 -40 – +105 (I) TFBGA-200 - P
W66BQ2NQU
  • Dual-Die-Package (DDP), dual channel memory
  • synchronous burst mode interface
  • burst length: 16/32 bytes
  • 8 banks
  • differential clock inputs
  • refresh modes: Auto Refresh (per bank), partial array Self Refresh
  • Power-down mode
  • operating temperature range: industrial (I), industrial plus (J)
 2 Gbit
(64Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 0.6 -40 – +95 (I)
-40 – +105 (I)		 WFBGA-200 - P
W66BP2NQU 2 Gbit
(64Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 1.1 -40 – +105 (I) WFBGA-200 - P
W66BQ2NQQ
  • Dual-Die-Package (DDP), dual channel memory
  • synchronous burst mode interface
  • burst length: 16/32 bytes
  • 8 banks
  • differential clock inputs
  • refresh modes: Auto Refresh (per bank), partial array Self Refresh
  • Power-down mode
  • operating temperature range: industrial (I), industrial plus (J)
 2 Gbit
(64Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 0.6 -40 – +95 (I)
-40 – +105 (I)		 TFBGA-200 - P
W66BP2NQQ 2 Gbit
(64Mx16x1 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 1.1 -40 – +105 (I) TFBGA-200 - P
W66CQ2NQU
  • Dual-Die-Package (DDP), dual channel memory
  • synchronous burst mode interface
  • burst length: 16/32 bytes
  • 8 banks
  • refresh modes: Auto Refresh (per bank), partial array Self Refresh
  • Power-down mode
  • operating temperature range: industrial plus (J), automotive
 4 Gbit
(128Mx16x2 channels)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 0.6 -40 – +105 (J)

Automotive		 WFBGA-200 P P
W66CP2NQU 4 Gbit
(128Mx16x2 channels)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 1.1 -40 – +105 (J)

Automotive		 WFBGA-200 P P
W66CQ2NQQ
  • Dual-Die-Package (DDP), dual channel memory
  • synchronous burst mode interface
  • burst length: 16/32 bytes
  • 8 banks
  • differential clock inputs
  • refresh modes: Auto Refresh (per bank), partial array Self Refresh
  • Power-down mode
  • operating temperature range: industrial (I), industrial plus (J)
 4 Gbit
(128Mx16x2 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 0.6 -40 – +95 (I)
-40 – +105 (I)		 TFBGA-200 - P
W66CP2NQQ 4 Gbit
(128Mx16x2 channel)		 1600 / 1866 / 2133 MHz 1.8 / 1.1 / 1.1 -40 – +105 (I) TFBGA-200 - P




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