News
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Nuvoton’s Endpoint AI Platform for Machine Learning
Nuvoton has introduced the Endpoint AI artificial intelligence platform to accelerate the development of full-featured AI microcontroller (MCU) products. These solutions are enabled by Nuvoton’s
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HyperRAM™ mobile memories in WLCSP packages
(Taichung, Taiwan – June 10, 2020) – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM™ products with WLCSP, which reaches an unprecedented thin form factor in embedded applications.