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TrustME™ Secure Flash from Winbond

Winbond Electronics Corporation company is introducing on the market new W77Q family of SPI Flash memories made in TrustME™ Secure Memory Technologies. They are a drop-in replacement for standard Flash devices but supporting security features that are essential in today’s information and communication systems, such as IoT (Internet of Things).

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HyperRAM™ mobile memories in WLCSP packages

HyperRAM™ devices with Wafer Level Chip Scale Package (WLCSP) help make form factor smaller and simpler.

(Taichung, Taiwan – June 10, 2020) – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM™ products with WLCSP, which reaches an unprecedented thin form factor in embedded applications.

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