8-bit 8051 Microcontrollers

Industrial 8051


All ICs are RoHS compliant.

* Status: P - mass production, S - samples, UD - under development, N - not recommended for new design.

Chip Description Application Flash  SRAM  Data Flash Loader Flash Programm.
methods
Clock
  frequency  
Supply
  voltage  
[V]
Operating
temperature
[°C]
   Package    Status *
MS51BA9AE
 (1201 kB)
  • 1T per machine cycle
  • application Flash memory programmed in IAP mode
  • 3 internal RC oscillators
  • on-the-fly clock source switch via software
  • up to 8 GPIO pins
  • 6 x 16-bit PWM outputs
  • 4 x 16-bit timers/counters
  • Watchdog
  • Wake-up timer
  • 2 x UART, I2C, SPI interfaces
  • 4 x 12-bit ADC (up to 500 ksps)
  • LDO
  • 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset)
  • temperature range: industrial
8 KB 1 KB configurable 4 KB IAP Ext. crystal:
-

Int. RC:
16 MHz (1 %)
24 MHz (1 %)
10 kHz
2.4 – 5.5 -40 – +105 MSOP-10 P
MS51DA9AE
 (1201 kB)
  • 1T per machine cycle
  • application Flash memory programmed in IAP mode
  • 3 internal RC oscillators
  • on-the-fly clock source switch via software
  • up to 12 GPIO pins
  • 6 x 16-bit PWM outputs
  • 4 x 16-bit timers/counters
  • Watchdog
  • Wake-up timer
  • 2 x UART, I2C, SPI interfaces
  • 5 x 12-bit ADC (up to 500 ksps)
  • LDO
  • 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset)
  • temperature range: industrial
8 KB 1 KB configurable 4 KB IAP Ext. crystal:
-

Int. RC:
16 MHz (1 %)
24 MHz (1 %)
10 kHz
2.4 – 5.5 -40 – +105 TSSOP-14 P
MS51EC0AE
 (1497 kB)
  • 1T per machine cycle
  • application Flash memory programmed in IAP mode
  • external crystal oscillators and 3 internal RC oscillators
  • on-the-fly clock source switch via software
  • up to 26 GPIO pins
  • 12 x 16-bit PWM outputs
  • 4 x 16-bit timers/counters
  • Watchdog
  • Wake-up timer
  • 2 x UART, I2C, SPI interfaces
  • 15 x 12-bit ADC (up to 500 ksps)
  • LDO
  • 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset)
  • temperature range: industrial
32 KB 2 KB configurable 4 KB IAP Ext. crystal:
24 MHz

Int. RC:
16 MHz (1 %)
24 MHz (1 %)
10 kHz
2.4 – 5.5 -40 – +105 TSSOP-28 P
MS51FB9AE
 (1225 kB)
  • 1T per machine cycle
  • application Flash memory programmed in IAP mode
  • 3 internal RC oscillators
  • on-the-fly clock source switch via software
  • up to 18 GPIO pins
  • 6 x 16-bit PWM outputs
  • 4 x 16-bit timers/counters
  • Watchdog
  • Wake-up timer
  • 2 x UART, I2C, SPI interfaces
  • 8 x 12-bit ADC (up to 500 ksps)
  • LDO
  • 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset)
  • temperature range: industrial
16 KB 1 KB configurable 4 KB IAP Ext. crystal:
-

Int. RC:
16 MHz (1 %)
24 MHz (1 %)
10 kHz
2.4 – 5.5 -40 – +105 TSSOP-20 P
MS51FC0AE
  • 1T per machine cycle
  • application Flash memory programmed in IAP mode
  • external crystal oscillators and 3 internal RC oscillators
  • on-the-fly clock source switch via software
  • up to 18 GPIO pins
  • 10 x 16-bit PWM outputs
  • 4 x 16-bit timers/counters
  • Watchdog
  • Wake-up timer
  • 2 x UART, I2C, SPI interfaces
  • 10 x 12-bit ADC (up to 500 ksps)
  • LDO
  • 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset)
  • temperature range: industrial
32 KB 2 KB configurable 4 KB IAP Ext. crystal:
24 MHz

Int. RC:
16 MHz (1 %)
24 MHz (1 %)
10 kHz
2.4 – 5.5 -40 – +105 TSSOP-20 P
MS51PC0AE
 (1497 kB)
  • 1T per machine cycle
  • application Flash memory programmed in IAP mode
  • external crystal oscillators and 3 internal RC oscillators
  • on-the-fly clock source switch via software
  • up to 30 GPIO pins
  • 12 x 16-bit PWM outputs
  • 4 x 16-bit timers/counters
  • Watchdog
  • Wake-up timer
  • 2 x UART, I2C, SPI interfaces
  • 15 x 12-bit ADC (up to 500 ksps)
  • LDO
  • 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset)
  • temperature range: industrial
32 KB 2 KB configurable 4 KB IAP Ext. crystal:
24 MHz

Int. RC:
16 MHz (1 %)
24 MHz (1 %)
10 kHz
2.4 – 5.5 -40 – +105 LQFP-32 P
MS51TC0AE
 (1497 kB)
  • 1T per machine cycle
  • application Flash memory programmed in IAP mode
  • external crystal oscillators and 3 internal RC oscillators
  • on-the-fly clock source switch via software
  • up to 30 GPIO pins
  • 12 x 16-bit PWM outputs
  • 4 x 16-bit timers/counters
  • Watchdog
  • Wake-up timer
  • 2 x UART, I2C, SPI interfaces
  • 15 x 12-bit ADC (up to 500 ksps)
  • LDO
  • 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset)
  • temperature range: industrial
32 KB 2 KB configurable 4 KB IAP Ext. crystal:
24 MHz

Int. RC:
16 MHz (1 %)
24 MHz (1 %)
10 kHz
2.4 – 5.5 -40 – +105 QFN-33 P
MS51XB9AE
 (1225 kB)
  • 1T per machine cycle
  • application Flash memory programmed in IAP mode
  • external crystal oscillators and 3 internal RC oscillators
  • on-the-fly clock source switch via software
  • up to 18 GPIO pins
  • 6 x 16-bit PWM outputs
  • 4 x 16-bit timers/counters
  • Watchdog
  • Wake-up timer
  • 2 x UART, I2C, SPI interfaces
  • 8 x 12-bit ADC (up to 500 ksps)
  • LDO
  • 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset)
  • temperature range: industrial
16 KB 1 KB configurable 4 KB IAP Ext. crystal:
-

Int. RC:
16 MHz (1 %)
24 MHz (1 %)
10 kHz
2.4 – 5.5 -40 – +105 QFN-20 P
MS51XC0AE
 (1497 kB)
  • 1T per machine cycle
  • application Flash memory programmed in IAP mode
  • external crystal oscillators and 3 internal RC oscillators
  • on-the-fly clock source switch via software
  • up to 18 GPIO pins
  • 10 x 16-bit PWM outputs
  • 4 x 16-bit timers/counters
  • Watchdog
  • Wake-up timer
  • 2 x UART, I2C, SPI interfaces
  • 10 x 12-bit ADC (up to 500 ksps)
  • LDO
  • 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset)
  • temperature range: industrial
32 KB 2 KB configurable 4 KB IAP Ext. crystal:
24 MHz

Int. RC:
16 MHz (1 %)
24 MHz (1 %)
10 kHz
2.4 – 5.5 -40 – +105 QFN-20 P